F2021
EVA商品价格以来电报价为准

规格级别 : 注塑级,加工级别 : 发泡级,注塑级, (更多..)

PTFE fine powder for unsintered thread sealing tape joint sealing and tubing applications

Features

• Meets ASTM D 4895-04 Type I, Grade 1, Class B classification.

• 3M™ Dyneon™ PTFE Paste TF 2021Z is the preferred grade for unsintered thread sealing tapes, expanded joint sealings and tubings

• High molecular weight PTFE powder produced by emulsion polymerization

• Fine powder grade for low to medium reduction ratios

• Providing high stretch ratio

• Product grade with lower extrusion pressure and green strength level than 3M™ Dyneon™ PTFE Paste TF 2025Z.

• Processing by standard paste extrusion methods

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As a low stress alternative for electronic packaging, NuSil Technology's silicones allow the designer to choose from a unique line of silicones for various levels of packaging. We have an extensive line of encapsulants, adhesives, and greases to choose from. These include thermally and electrically conductive silicones for Thermal Interface Materials (TIM) or for EMI and RFI shielding applications.

Benefits of Silicone for Electronics:

• Wide Operating Temperature Range of -115 °C to 250 °C

• Low moisture absorption, < 0.4% Typical

• Corrosion Resistance

• High Dielectric Strength > 500 V/mil (0.001 inch) or 20 kV/mm

• Fillers can be added to provide thermal and electrical conductive properties

• Low Modulus (Typically less than 5.5 MPa/800 psi)

• Stable chemical and mechanical properties when exposed to high temperatures

• Low Shrinkage

• Available as gels, elastomers, film adhesives sheeting, and greases

General Purpose: Adhesives and Sealants

Comments: Longer Work Time (更多..)