| 牌号 | BR® 624 |
| 厂家 | Cytec Industries Inc. |
| 分类 | 环氧 |
| 介绍 | BR® 624 potting compound is a one-part, low density material formulated for use in insert or edge filling of honeycomb sandwich construction. It is a thermosetting, modified epoxy system, serviceable over a temperature range of -70 to 350°F (-57 to 177°C). BR 624 potting compound is thixotropic and cure cycles may be varied over a broad range. Cure temperatures as low as 225°F (107°C) and as high as 350°F (177°C) have been used successfully. Multiple cure cycles at temperatures up to 350°F (177°C) will not impair its use as a structural material. Suggested Applications: Insert and edge filling of honeycomb structures |
| Cytec Industries Inc. 产品展示 | 种类 |
|---|---|
| CYCOM® 823 RTM | 环氧 |
| CONAPOXY® FR-1080 | 环氧 |
| LTM® 202 | 环氧 |
| BR® 95 | 环氧 |
| BR® 623-1 | 环氧 |
| DAPCO™ 3041FR | 环氧 |
| MTM® 71 | 环氧 |
| MTM® 57 series | 环氧 |
| CYCOM® 7668 | 环氧 |
| CYCOM® 381 | 环氧 |
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