牌号 | EPO-TEK® H67MP-GB |
厂家 | Epoxy Technology Inc. |
分类 | 环氧 |
介绍 | A single component, thermally conductive, electrically insulating epoxy designed to meet the requirements of MIL-STD-883/Test Method 5011 for hybrid microelectronic packaging and assemblies. It maybe used for bonding SMDs, die-attach, substrate-attach or general heat sinking. It is a version of EPO-TEK® H67MP which contains 2 mil glass beads. |
Epoxy Technology Inc. 产品展示 | 种类 |
---|---|
EPO-TEK® OG159-2 | 环氧 |
EPO-TEK® 310M Black | 环氧 |
EPO-TEK® B9021-13 | 环氧 |
EPO-TEK® OG653 | 环氧 |
EPO-TEK® 310M-2 | 环氧 |
EPO-TEK® TJ1104-LH | 环氧 |
EPO-TEK® T6067-3 | 环氧 |
EPO-TEK® H20S-D | 环氧 |
EPO-TEK® 302 | 环氧 |
EPO-TEK® H31D-LV | 环氧 |
订购说明