| 牌号 | EPO-TEK® H67MP-GB |
| 厂家 | Epoxy Technology Inc. |
| 分类 | 环氧 |
| 介绍 | A single component, thermally conductive, electrically insulating epoxy designed to meet the requirements of MIL-STD-883/Test Method 5011 for hybrid microelectronic packaging and assemblies. It maybe used for bonding SMDs, die-attach, substrate-attach or general heat sinking. It is a version of EPO-TEK® H67MP which contains 2 mil glass beads. |
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