牌号 | EPO-TEK® H67MP-GB |
厂家 | Epoxy Technology Inc. |
分类 | 环氧 |
介绍 | A single component, thermally conductive, electrically insulating epoxy designed to meet the requirements of MIL-STD-883/Test Method 5011 for hybrid microelectronic packaging and assemblies. It maybe used for bonding SMDs, die-attach, substrate-attach or general heat sinking. It is a version of EPO-TEK® H67MP which contains 2 mil glass beads. |
Epoxy Technology Inc. 产品展示 | 种类 |
---|---|
EPO-TEK® B9021-15 | 环氧 |
EPO-TEK® U300-2 | 环氧 |
EPO-TEK® EK2000 | 环氧 |
EPO-TEK® CF6-2 | 环氧 |
EPO-TEK® T6067 | 环氧 |
EPO-TEK® H63 | 环氧 |
EPO-TEK® H81A | 环氧 |
EPO-TEK® H37-MP | 环氧 |
EPO-TEK® H65-175MP | 环氧 |
EPO-TEK® H62 | 环氧 |
订购说明