牌号 | EPO-TEK® OG133-8 |
厂家 | Epoxy Technology Inc. |
分类 | 环氧 |
介绍 | A single component, UV curable, thixotropic flexible epoxy adhesive/encapsulant designed for semiconductor and opto-electronic packaging. Glob top over IC and wire bonds, and low stress bonding of fiber optic components, are common applications. It is a replacement for EPO-TEK® OG133-5, and a non-flow version of EPO-TEK® OG133-7. Formerly 90-36-4 |
Epoxy Technology Inc. 产品展示 | 种类 |
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