| 牌号 | FM® 6604-1 |
| 厂家 | Cytec Industries Inc. |
| 分类 | MAH-g |
| 介绍 | FM® 6604-1 is a modified bismaleimide (BMI) resin core splice foaming adhesive. It has a cure temperature of 350°F (177°C) with a post-cure at 440°C (227°C). The service temperature is -67°F to 450°F (-57°C to 232°C) with post-cure. Suggested Applications: Core shear-ties Edge closeouts Insert bonding |
| Cytec Industries Inc. 产品展示 | 种类 |
|---|---|
| FM® 450-1 | MAH-g |
| CYCOM® 5250-4 RTM | MAH-g |
| FM® 475 | MAH-g |
| HTA® 512 | MAH-g |
| HTM® 556 | MAH-g |
| METLBOND® 2550 | MAH-g |
| FM® 6604-1 | MAH-g |
| CORFIL® 5250-4 | MAH-g |
| CYCOM® 5250-4 | MAH-g |
| HTM® 512-1 | MAH-g |
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