| 牌号 | Glastic® 1401 |
| 厂家 | Bulk Molding Compounds, Inc. |
| 分类 | 聚酯,TS |
| 介绍 | Grade 1401 is an electrical grade of encapsulating material. Characterized by a balance of soft flow and cure rate to ensure complete and proper encapsulation without voiding. Generally too soft for compression molding, but excellent in transfer or injection processes. Directly competitive against epoxy encapsulants on cost and cycle times. Very stable shelf life. |
| Bulk Molding Compounds, Inc. 产品展示 | 种类 |
|---|---|
| BMC 5592 | 聚酯,TS |
| BMC 5209 | 聚酯,TS |
| BMC 3001H | 聚酯,TS |
| BMC 615 | 聚酯,TS |
| Glastic® 1423 | 聚酯,TS |
| BMC 501 | 聚酯,TS |
| BMC T15(GP) | 聚酯,TS |
| BMC HT12-1027 | 聚酯,TS |
| BMC 620X | 聚酯,TS |
| BMC A50 (MS) | 聚酯,TS |
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