牌号 | EPO-TEK® H37-MPT |
厂家 | Epoxy Technology Inc. |
分类 | 环氧 |
介绍 | A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding SMDs for hybrid microelectronic packaging. It is certified and lot accepted to the requirements of MIL-STD 883/Test Method 5011. It can be used for opto-packaging including LEDs, laser and photo-diodes, and fiber optic circuit assembly. |
Epoxy Technology Inc. 产品展示 | 种类 |
---|---|
EPO-TEK® E2001-HV | 环氧 |
EPO-TEK® H20E-8 | 环氧 |
EPO-TEK® EJ2189-LV | 环氧 |
EPO-TEK® H74 | 环氧 |
EPO-TEK® OE121 | 环氧 |
EPO-TEK® 302 | 环氧 |
EPO-TEK® H24 | 环氧 |
EPO-TEK® OJ2933-LH | 环氧 |
EPO-TEK® GE120 | 环氧 |
EPO-TEK® E3037 | 环氧 |
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