牌号 | EPO-TEK® H37-MPT |
厂家 | Epoxy Technology Inc. |
分类 | 环氧 |
介绍 | A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding SMDs for hybrid microelectronic packaging. It is certified and lot accepted to the requirements of MIL-STD 883/Test Method 5011. It can be used for opto-packaging including LEDs, laser and photo-diodes, and fiber optic circuit assembly. |
Epoxy Technology Inc. 产品展示 | 种类 |
---|---|
EPO-TEK® E2001 | 环氧 |
EPO-TEK® H70E-4 | 环氧 |
EPO-TEK® 301-2FL | 环氧 |
EPO-TEK® H63 | 环氧 |
EPO-TEK® OJ2116 | 环氧 |
EPO-TEK® 360 | 环氧 |
EPO-TEK® 323LP-LH Premium | 环氧 |
EPO-TEK® B9126-8 | 环氧 |
EPO-TEK® OG146-178 | 环氧 |
EPO-TEK® OG116 | 环氧 |
订购说明