| 牌号 | EPO-TEK® H37-MPT |
| 厂家 | Epoxy Technology Inc. |
| 分类 | 环氧 |
| 介绍 | A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding SMDs for hybrid microelectronic packaging. It is certified and lot accepted to the requirements of MIL-STD 883/Test Method 5011. It can be used for opto-packaging including LEDs, laser and photo-diodes, and fiber optic circuit assembly. |
| Epoxy Technology Inc. 产品展示 | 种类 |
|---|---|
| EPO-TEK® B9101-2 Unfilled | 环氧 |
| EPO-TEK® TJ1104-LH | 环氧 |
| EPO-TEK® 731 | 环氧 |
| EPO-TEK® 323LP | 环氧 |
| EPO-TEK® B9126-8 | 环氧 |
| EPO-TEK® H70E-175 | 环氧 |
| EPO-TEK® EE165-3 | 环氧 |
| EPO-TEK® H31 | 环氧 |
| EPO-TEK® H70E-TI | 环氧 |
| EPO-TEK® H35-175MP | 环氧 |
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