牌号 | EPO-TEK® H67MP-T |
厂家 | Epoxy Technology Inc. |
分类 | 环氧 |
介绍 | A single component, thermally conductive, electrically insulating epoxy designed to meet the requirements of MIL-STD 883, Test Method 5011 for hybrid microelectronic packaging and assemblies. It may be used for bonding SMDs, die-attach, substrate-attach or general heat sinking. Meets MIL-STD-883, Method 5011. A thixotropic version of EPO-TEK® H67MP. |
Epoxy Technology Inc. 产品展示 | 种类 |
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EPO-TEK® E3037-LV | 环氧 |
EPO-TEK® OG116 | 环氧 |
EPO-TEK® H67-MP | 环氧 |
EPO-TEK® 310M | 环氧 |
EPO-TEK® OE100-T | 环氧 |
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