| 牌号 | EPO-TEK® H67MP-T |
| 厂家 | Epoxy Technology Inc. |
| 分类 | 环氧 |
| 介绍 | A single component, thermally conductive, electrically insulating epoxy designed to meet the requirements of MIL-STD 883, Test Method 5011 for hybrid microelectronic packaging and assemblies. It may be used for bonding SMDs, die-attach, substrate-attach or general heat sinking. Meets MIL-STD-883, Method 5011. A thixotropic version of EPO-TEK® H67MP. |
| Epoxy Technology Inc. 产品展示 | 种类 |
|---|---|
| EPO-TEK® OG133-8 | 环氧 |
| EPO-TEK® UD1355 | 环氧 |
| EPO-TEK® H67MP-GB | 环氧 |
| EPO-TEK® OE101 | 环氧 |
| EPO-TEK® E2001-6 | 环氧 |
| EPO-TEK® MA-5 | 环氧 |
| EPO-TEK® H20E-SLR-MX | 环氧 |
| EPO-TEK® OG116-31 | 环氧 |
| EPO-TEK® T905BN-3 | 环氧 |
| EPO-TEK® OG178 | 环氧 |
订购说明
