| 牌号 | EPO-TEK® H67MP-T |
| 厂家 | Epoxy Technology Inc. |
| 分类 | 环氧 |
| 介绍 | A single component, thermally conductive, electrically insulating epoxy designed to meet the requirements of MIL-STD 883, Test Method 5011 for hybrid microelectronic packaging and assemblies. It may be used for bonding SMDs, die-attach, substrate-attach or general heat sinking. Meets MIL-STD-883, Method 5011. A thixotropic version of EPO-TEK® H67MP. |
| Epoxy Technology Inc. 产品展示 | 种类 |
|---|---|
| EPO-TEK® OG142-87 | 环氧 |
| EPO-TEK® 354-T | 环氧 |
| EPO-TEK® T6067 | 环氧 |
| EPO-TEK® H20E-HC | 环氧 |
| EPO-TEK® OG133-8 | 环氧 |
| EPO-TEK® OG159-2 | 环氧 |
| EPO-TEK® T6067-3 | 环氧 |
| EPO-TEK® H35-175MP | 环氧 |
| EPO-TEK® H70E-2LC | 环氧 |
| EPO-TEK® 302-3M | 环氧 |
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